Shift Towards Advanced Packaging Technologies to Drive the Growth of Global 3d Ics Market

https://www.coherentmarketinsights.com/market-insight/3d-ics-market-3941
3d Ics Market



Market Overview:
3D ICs help integrate various electronic components into a single chip through stacking of silicon wafers or silicon dice and interconnecting them vertically. This allows for a very high density of components using the third dimension next to the conventional two dimensions. The technology enables significant improvement in performance, power consumption and cost compared to conventional ICs.

Market key trends:
One of the major trends driving the growth of 3D ICs market is the growing demand for smartphones and wearable devices. The continuous demand for higher performance and lower power consumption integrated circuits for applications such as mobile processing, graphics, artificial intelligence etc. is fueling the need for 3D IC technologies. Stacked die packaging allows for more transistors per unit area, higher bandwidth and lower power consumption compared to planar ICs. This makes 3D ICs very well suited to meet the requirements of next generation mobile and wearable devices.

The global 3d Ics Market Demand is estimated to be valued at US$ 16937.26 Mn in 2023 and is expected to exhibit a CAGR of 22% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.

Segment Analysis
The 3d ICs market can be segmented based on application into memory, logic, MEMS, CMOS image sensors, LED and others. The memory segment dominated the 3d ICs market in 2023 and is expected to continue its dominance going forward. This is because 3d integration helps improve the memory density and reduces chip size significantly. 3d integration stacked dynamic random-access memory (DRAM) and embedded DRAM memory chips are witnessing high demand from consumer electronics and mobile devices.

Key Takeaways
The global 3d ICs market is expected to witness high growth, exhibiting a CAGR of 22% over the forecast period, due to increasing demand for miniaturization of electronic devices and the need to improve functionality.

Regional analysis
Asia Pacific dominated the global 3d ICs market in 2023 and is projected to grow at the fastest rate during the forecast period. This is attributed to the presence of key foundries like Taiwan Semiconductor Manufacturing Company and United Microelectronics Corporation in countries like Taiwan and China. These foundries are focusing on technology innovation to manufacture more advanced 3d integrated chips.

Key players
Key players operating in the 3d ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Micron Technology, Inc., The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation. Taiwan Semiconductor Manufacturing Company holds a significant share in the market due to its expertise in packaging and stacking technologies.

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